TY - GEN
T1 - An architectural framework for low-power IoT applications
AU - Yelmarthi, Kumar
AU - Abdelgawad, Ahmed
AU - Khattab, Ahmed
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/7/2
Y1 - 2016/7/2
N2 - The Internet of Things (IoT) is connecting relatively low bandwidth sensing devices to the Internet. Given the IoT computational paradigm, applications that touch every aspect of modern life are now rapidly evolving. In order to keep up with the evolving future, a unified real-time, low-power, low-cost, and reliable IoT framework is needed. This paper proposes such an IoT architectural framework with configurable nodes and multiple sensors that could be utilized in diverse applications. The sensor nodes collect data from the surrounding environment and pass it to the cloud for universal accessibility by the users. The proposed framework can be used for diverse applications and has been verified through hardware implementation for applications such as healthcare, wearables, structural health monitoring, object tracking, and connected vehicles.
AB - The Internet of Things (IoT) is connecting relatively low bandwidth sensing devices to the Internet. Given the IoT computational paradigm, applications that touch every aspect of modern life are now rapidly evolving. In order to keep up with the evolving future, a unified real-time, low-power, low-cost, and reliable IoT framework is needed. This paper proposes such an IoT architectural framework with configurable nodes and multiple sensors that could be utilized in diverse applications. The sensor nodes collect data from the surrounding environment and pass it to the cloud for universal accessibility by the users. The proposed framework can be used for diverse applications and has been verified through hardware implementation for applications such as healthcare, wearables, structural health monitoring, object tracking, and connected vehicles.
KW - IoT framework
KW - hardware implementation
KW - multi-layer architecture
KW - wireless sensor networks
UR - http://www.scopus.com/inward/record.url?scp=85014913561&partnerID=8YFLogxK
U2 - 10.1109/ICM.2016.7847893
DO - 10.1109/ICM.2016.7847893
M3 - Conference contribution
AN - SCOPUS:85014913561
T3 - Proceedings of the International Conference on Microelectronics, ICM
SP - 373
EP - 376
BT - ICM 2016 - 28th International Conference on Microelectronics
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 17 December 2016 through 20 December 2016
ER -