TY - GEN
T1 - Cluster tool design comparisons via simulation
AU - Park, Kyungsu
AU - Morrison, James R.
PY - 2011
Y1 - 2011
N2 - The anticipated transition to 450 mm diameter wafers provides the semiconductor manufacturing industry an opportunity to consider new equipment designs that address issues associated with small lot sizes and high mix production. One candidate design is the linear cluster tool. Compared to traditional circular cluster tools, linear cluster tools have advantages such as high flexibility and greater productivity. In this paper, we develop a simulation of cluster tools with realistic parameters, which incorporates rolling setups and wet cleans. We use the simulation to study the effect of rolling setups and wet cleans with different lot sizes and train levels. For the simulation based on data from a BlueShift cluster tool in production, the linear cluster tool has 5.22% and 4.09% greater throughput with rolling setups and both rolling setups and wet cleans, respectively.
AB - The anticipated transition to 450 mm diameter wafers provides the semiconductor manufacturing industry an opportunity to consider new equipment designs that address issues associated with small lot sizes and high mix production. One candidate design is the linear cluster tool. Compared to traditional circular cluster tools, linear cluster tools have advantages such as high flexibility and greater productivity. In this paper, we develop a simulation of cluster tools with realistic parameters, which incorporates rolling setups and wet cleans. We use the simulation to study the effect of rolling setups and wet cleans with different lot sizes and train levels. For the simulation based on data from a BlueShift cluster tool in production, the linear cluster tool has 5.22% and 4.09% greater throughput with rolling setups and both rolling setups and wet cleans, respectively.
UR - http://www.scopus.com/inward/record.url?scp=84858029245&partnerID=8YFLogxK
U2 - 10.1109/WSC.2011.6147901
DO - 10.1109/WSC.2011.6147901
M3 - Conference contribution
AN - SCOPUS:84858029245
SN - 9781457721083
T3 - Proceedings - Winter Simulation Conference
SP - 1872
EP - 1882
BT - Proceedings of the 2011 Winter Simulation Conference, WSC 2011
Y2 - 11 December 2011 through 14 December 2011
ER -