Effect of addition of Ni and Ag on Cu-CNT composites electrical conductivity

N. D.H. Munroe, S. Amruthaluri, P. K.S. Gill, W. Haider

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Copper-Carbon nanotube (Cu-CNT) composites are of great interest due to their wide range of applications in electrical appliances. In recent years the researchers have shown lot of interest in this composite. Powder metallurgy technique was used to prepare Cu-Multi Walled Carbon Nanotube (MWCNT) composite with addition of Silver (Ag) and Nickel (Ni). Different compositions were prepared for comparative analysis. Enhancement in electrical conductivity of this composite was observed by using four probe methods. Scanning Electron Microscopy (SEM) and X-ray mapping showed homogenous mixing of MWCNTs in the composite. This composite overcomes the limitations of interfacial bonding in Cu-MWCNT matrix and homogenous distribution of MWCNTs. Our investigation demonstrated that addition of Ag and Ni resinates changes the morphology of the composite by increasing the interfacial bonding between Cu and MWCNT.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition MS and T'08
Pages2298-2308
Number of pages11
StatePublished - 2008
EventMaterials Science and Technology Conference and Exhibition, MS and T'08 - Pittsburgh, PA, United States
Duration: Oct 5 2008Oct 9 2008

Publication series

NameMaterials Science and Technology Conference and Exhibition, MS and T'08
Volume4

Conference

ConferenceMaterials Science and Technology Conference and Exhibition, MS and T'08
Country/TerritoryUnited States
CityPittsburgh, PA
Period10/5/0810/9/08

Keywords

  • CNT
  • MMC's
  • MWCNT
  • SEM/EDS

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