Equipment models for fab level proudction simulation: Practical features and computational tractability

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

Equipment models used in fab-level simulation do not typically include features such as internal wafer buffers and setups that depend on wafer locations inside the tool. Such features are especially important to system performance in the presence of smaller lot sizes and greater product diversity. In this paper, we provide an introduction to flow line models that allow one to incorporate these key practical behaviors. We then develop flow line models for clustered photolithography tools and conduct simulations to assess the quality of the models. Despite the fact that the models only incorporate wafer transport robots via a constant addition to the process time, they can be quite accurate. When tested against data from a clustered photolithography tool in production, the model predictions for throughput and cycle time were within 1% and 4%, respectively. The computational requirements are about one order of magnitude less than is otherwise possible.

Original languageEnglish
Title of host publicationProceedings of the 2009 Winter Simulation Conference, WSC 2009
Pages1581-1591
Number of pages11
DOIs
StatePublished - 2009
Event2009 Winter Simulation Conference, WSC 2009 - Austin, TX, United States
Duration: Dec 13 2009Dec 16 2009

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2009 Winter Simulation Conference, WSC 2009
Country/TerritoryUnited States
CityAustin, TX
Period12/13/0912/16/09

Fingerprint

Dive into the research topics of 'Equipment models for fab level proudction simulation: Practical features and computational tractability'. Together they form a unique fingerprint.

Cite this