TY - GEN
T1 - Lab in a Box
AU - Maitra, Sudip
AU - Abdelgawad, Ahmed
AU - Yelamarthi, Kumar
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - The advent of Internet of Things (IoT) has brought about a new horizon in the field of pervasive computing and network-oriented systems. IoT has enabled everyday 'things' to communicate with each other, exchange information and perform tasks more efficiently in terms of power and resources while requiring minimum human intervention. As the application scope of IoT is tremendously vast, the integration of heterogeneous objects or 'things' in an IoT system is a challenging task. In this paper, multiple embedded systems have been implemented in battery powered, small portable packages to acquire environmental data from various sensors and publish the information to several IoT cloud platforms for analysis and visualization, using different wireless transceiver technologies to demonstrate the portability, modularity, and interoperability of Lab in a Box.
AB - The advent of Internet of Things (IoT) has brought about a new horizon in the field of pervasive computing and network-oriented systems. IoT has enabled everyday 'things' to communicate with each other, exchange information and perform tasks more efficiently in terms of power and resources while requiring minimum human intervention. As the application scope of IoT is tremendously vast, the integration of heterogeneous objects or 'things' in an IoT system is a challenging task. In this paper, multiple embedded systems have been implemented in battery powered, small portable packages to acquire environmental data from various sensors and publish the information to several IoT cloud platforms for analysis and visualization, using different wireless transceiver technologies to demonstrate the portability, modularity, and interoperability of Lab in a Box.
KW - IoT
KW - edge computing
KW - modular architecture
UR - http://www.scopus.com/inward/record.url?scp=85074984588&partnerID=8YFLogxK
U2 - 10.1109/MWSCAS.2019.8885247
DO - 10.1109/MWSCAS.2019.8885247
M3 - Conference contribution
AN - SCOPUS:85074984588
T3 - Midwest Symposium on Circuits and Systems
SP - 472
EP - 475
BT - 2019 IEEE 62nd International Midwest Symposium on Circuits and Systems, MWSCAS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 4 August 2019 through 7 August 2019
ER -