Nanoscale high-Κ/metal-gate CMOS and FinFET based logic libraries

Venkata P. Yanambaka, Saraju P. Mohanty, Elias Kougianos, Dhruva Ghai

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

3 Scopus citations

Abstract

During the last four decades, VLSI technology growth has been driven by miniaturization that reduces cost per transistor, power consumption per transistor, with higher packing density and reduced cost of operation. However, the small transistor size leads to very high electric fields across the gate oxide which causes the difficult problem of gate-oxide leakage. This problem is mitigated by high-Κ/ metal-gate (HKMG) technology, in which the gate material is copper (going back to metal from polysilicon), and the gate-oxide material is not silicon dioxide. At the same time, explosive growth of mobile portable electronics has been the driver for many scientific, engineering, and technological breakthroughs in the last few decades. Mobile electronics in particular, such as smart mobile phones, spend most of their operational time in waiting for a call or similar event. However, during these wait states, leakage power dissipation has been a major issue since it drains the battery continuously. The industry has explored various solutions to reduce the OFF-state leakage and multiple gate devices emerged as a solution to this problem. Double-gate FinFET technology is considered as a solution to reduce OFF-state leakage while having faster ON and OFF transitions and low-power (LP) dissipation. This chapter discusses these devices and presents logic libraries which can be used in the digital synthesis of large integrated circuits using such devices through electronic design automation (EDA) tools.

Original languageEnglish
Title of host publicationNano-CMOS and Post-CMOS Electronics
Subtitle of host publicationDevices and Modelling
PublisherInstitution of Engineering and Technology
Pages169-211
Number of pages43
ISBN (Electronic)9781849199988
ISBN (Print)9781849199971
DOIs
StatePublished - Jan 1 2016

Keywords

  • CMOS logic circuits
  • Copper
  • Copper
  • Cu
  • Digital synthesis
  • Double-gate FinFET technology
  • EDA tools
  • Electric fields
  • Electronic design automation
  • Electronic design automation
  • Gate oxide leakage
  • Gate-oxide material
  • HKMG technology
  • Integrated circuit packaging
  • Integrated circuits
  • LP dissipation
  • Leakage power dissipation
  • Logic design
  • Logic libraries
  • Low-power dissipation
  • Low-power electronics
  • MOSFET
  • Mobile portable electronics
  • Multiple gate devices
  • Nanoelectronics
  • Nanoscale high-K-metal-gate CMOS
  • OFF-state leakage
  • Packing density
  • Polysilicon
  • Power consumption
  • Semiconductor device packaging
  • Smart mobile phones
  • VLSI
  • VLSI technology

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