Photoresistive polyimide homo- and copolymers containing varying amounts of Bis aniline-P (Bis-P), tetramethyl Bis aniline-P (TM Bis-P), 1,4 tetramethyl phenylene diamine (TMPDA), and polydimethylsiloxane segment incorporation with benzophenone tetracarboylic dianhydride (BTDA) have been synthesized and characterized. The amic acid prepolymers were prepared by solution synthesis of the appropriate diamines and dianhydride in the dipolar aprotic solvent N-methyl pyrolidinone (NMP). A cosolvent system of tetrahydrofuran (THF) and NMP was utilized in the synthesis of the siloxane modified polyimides. The high molecular weight polyamic acids were imidized by a solution imidization procedure which utilized a cosolvent system of NMP and cyclohexyl pyrrolidinone (CHP) at temperatures of 170°C. The fully imidized polymers are soluble in a variety of solvents. The TMPDA polyimides also show upper glass transition temperatures of more than 400°C. The photosensitivities of the polyimide and poly(imide siloxane) homo- and copolymers were determined at UV wavelengths of 313nm and 365nm. Increasing the amounts of benzylic methyl substituted diamine incorporated into the polyimide backbone afforded more photosensitive polymer systems. Incorporation of the polydimethylsiloxane segments into the polyimide backbone decreased the optical density without decreasing the photosensitivity and therefore allowed thicker films to be crosslinked at lower exposure doses.
|Number of pages||11|
|Journal||International SAMPE Symposium and Exhibition (Proceedings)|
|State||Published - 1989|
|Event||3rd International SAMPE Electronics Conference: Electronic Materials and Processes - Los Angeles, CA, USA|
Duration: Jun 20 1989 → Jun 22 1989